Product positioning and core values

PACSystems RX3i I/O is a modular industrial grade input/output system launched by Emerson, designed specifically for process control, hybrid control, and discrete control scenarios. Its core advantages lie in high-performance data transmission, flexible scalability, and comprehensive diagnostic capabilities, which can adapt to automation needs from small and medium-sized equipment to large and complex production lines. At the same time, it provides a convenient legacy system upgrade path to protect users’ existing investments.

Core Features and Advantages

1. Modular design and high-speed performance

Rich module types: covering digital quantities (voltage, relay output), analog quantities (voltage/current, RTD, thermocouple), and special I/O (high-speed counter, PWM pulse output, strain gauge acquisition, event sequence SoE input), supporting different voltage ranges (such as 24Vdc, 120Vac) and current capacities to meet diverse industrial signal processing needs;

Hot swappable function: All I/O modules support hot swappable, allowing for module replacement without the need to power off, reducing maintenance downtime;

High speed data transmission: Based on high-speed backplane interface, it ensures fast and stable transmission of I/O data, with response speed far exceeding traditional control systems, and is suitable for scenarios with high real-time requirements (such as motion control and precision process adjustment).

2. High scalability and flexible deployment

Customizable scale: A single system supports 8-32000 I/O points, providing various specifications of backplanes such as 7-slot, 12 slot, 16 slot, and 1-slot expansion units, which can be flexibly combined according to application scale;

Multi scenario expansion: Supports local expansion (main backplane overlay expansion backplane) and remote expansion (connected to remote I/O racks through Ethernet or serial bus), with a maximum of 448 I/O points supported by a single drop, suitable for decentralized device layout (such as multi area control in large factory areas);

Media compatibility: support copper cable, SM Fiber, and MM Fiber, and adapt to different transmission distance requirements (such as long-distance communication across buildings in the plant).

3. High availability and redundancy guarantee

Multi level redundancy:

Network redundancy: Supports Media Redundancy Protocol (MRP) and dual LAN architecture to avoid single network link failures;

System redundancy: compatible with PROFINET system redundancy (PNSR) and Ethernet global data (EGD), achieving bumpless switching over between controllers and I/O systems;

I/O redundancy: Key I/O channel redundancy can be configured through application code to further enhance system reliability;

Anti interference and environmental adaptability: Equipped with * * galvanic isolation * * (supporting both digital and analog input and output), strong anti electromagnetic interference capability; The default working temperature is 0-60 ℃, with optional -40~60 ℃ wide temperature version and normal coating (moisture-proof, dust-proof), suitable for harsh industrial environments.

4. Convenient maintenance and compatibility

Easy to connect design: All modules are equipped with pluggable terminal blocks, supporting solid/multi strand wires of 0.081~1.5mm ² (28~14AWG), providing both spring and box terminal types, supporting Terminal Block Quick Connect (TBQC) and forward fixation to ensure stable wiring;

Legacy system upgrade friendly: Series 90-30 modules can be directly reused on the RX3i backplane without rewiring or replacing I/O devices, and the upgrade process only takes a few hours (instead of the traditional solution of days); Simultaneously integrating Ethernet and USB interfaces to replace outdated serial interfaces, enhancing communication flexibility and speed (over 100 times faster than legacy systems).

Detailed explanation of technical specifications

1. Hardware and environmental parameters

Category specific parameters

Installation methods: Panel Mount, Rack Mount

Protection level IP20 (dustproof, preventing fingers from entering)

Working temperature standard: 0-60 ℃; Optional wide temperature range: -40~60 ℃

Isolation performance: All DI/DO/AI/AO channels support galvanic isolation to reduce ground current interference

Terminal specifications: Low density terminals support up to 12AWG wires, while high-density terminals support up to 14AWG wires

Certification standards UL, UL Hazardous Area Certification (Class I Division 2), CE, ATEX Zone 2; Some models support classification certification (ABS, BV, DNV GL)

2. Network and communication capabilities

Core network interfaces: PROFINET, Modbus/TCP, Ethernet Global Data (EGD), Control Memory Switching (CMX), PROFIBUS DP;

Gateway/Bridge Function: Supports serial communication Modbus/RTU、HART、GENIUS、DNP3 Serial/TCP、IEC-61850、IEC-104、 Reflective Memory, CANOpen, etc. can seamlessly integrate with devices from different manufacturers, such as instruments, frequency converters, and third-party PLCs;

Communication port: equipped with 2 RJ45 Ethernet ports and 2 SFP optical ports, supporting flexible switching between fiber and copper cables.

3. Diagnostic and monitoring capabilities

Advanced diagnostic function: The module is equipped with a comprehensive self diagnostic mechanism, which can monitor the terminal wiring status, signal abnormalities (such as overcurrent and over range), module faults in real time, and display alarm information through the controller or upper computer (such as Emerson Proficy software) to quickly locate the problem;

Status visualization: The module LED indicator lights provide clear feedback on power, communication, and channel fault status, making it easy for on-site maintenance personnel to quickly troubleshoot.

I/O module classification and typical models

1. Digital I/O module

Module type, typical model, key parameters

Digital input IC694MDL645 24Vdc, 16 points, positive and negative logic, isolated

IC694MDL240 120Vac， 16:00, non isolated

Digital output IC694MDL730 12/24VDC, 2A, 8 points, positive logic

IC694MDL930 relay output (normally open), 4A, 8 points, isolated

Mixed digital I/O IC694MDR390 24Vdc input (8 points)+relay output (8 points), integrated input-output function

2. Analog I/O module

Module type, typical model, key parameters

Analog input IC695ALG600 universal type, supports voltage/current/RTD/thermocouple, 8-channel non isolated/4-channel differential

IC695ALG306 isolated thermocouple input, 6-channel, compatible with various thermocouple types such as J/K/T

Analog output IC694ALG392 8-channel, supports voltage/current output, non isolated

IC695ALG728 8-channel, voltage/current output, supports HART protocol, can communicate with smart instruments

Mixed analog I/O IC694ALG442 with 4 analog inputs and 2 analog outputs, supporting voltage/current signals

3. Special and Interface Modules

Module type, typical model, key parameters

High speed counter IC695HSC304 1.5MHz, 8 inputs, 7 outputs, supports quadrature encoding, pulse counting, etc

IC694DSM324 multi axis motion controller, compatible with servo/stepper motor control, supports point and trajectory planning

Communication module IC695PNC001 PROFINET controller module, realizing PROFINET network management and device docking

IC695CMM004 4-port serial communication module, supporting RS232/485, compatible with Modbus/RTU and other protocols

Power module IC695PSA040 120/240VAC input, 125Vdc output, 40W, providing stable power supply for the main backplane

IC695PSD140 24Vdc input, 40W multi-purpose power supply, suitable for DC power supply scenarios

Comparison with other Emerson I/O products

The positioning differences between RX3i I/O and other Emerson I/O series can be clearly distinguished through the following table for easy selection:

Product Series Types Core Features Typical Application Scenarios Environmental Adaptability

PACSystems RX3i Chassis Based high performance, high diagnostic capability, support for redundant complex machine control, process control, motion control 0~60 ℃ (optional -40 ℃ wide temperature)

RSTi EP distributed slice miniaturization, decentralized deployment single machine control, lightweight process control -20~60 ℃, IP20

VersaPoint distributed slicing function safety certification (SIL3) safety related controls (such as emergency stop, safety interlock) -20~55 ℃, IP20

RSTi OM on machine distributed (On machine) high protection (IP67), cabinet free installation robots, mobile devices and other non control cabinet scenarios -20~60 ℃, IP67

PAC8000 intrinsic safety explosion-proof certification (ATEX Zone 1) for hazardous environments (such as chemical and oil and gas sites) -40~70 ℃, IP20

Order information and attachments

1. Core component models (some key models)

Component category and model description

Power module IC695PSA040 120/240Vac/125VDC input, 40W, main power supply

IC695PSD140 24Vdc input, 40W multi-purpose power supply

IC694PWR321 120/240Vac/125VDC input, 30W, serial expansion power supply

Backboard IC695CHS007 7-slot universal backplate

IC695CHS016 16 slot universal backplate

IC694CHS392 10 slot serial expansion backplane

Digital input IC694MDL645 24Vdc, 16 points, positive and negative logic, isolated

Digital output IC694MDL730 12/24VDC, 2A, 8 points, positive logic

Analog input IC695ALG600 universal type, 8-channel non isolated/4-channel differential, supports RTD/TC/voltage/current

Analog output IC694ALG392 8-channel, voltage/current output

Note: The meaning of the model suffix is: LT=low temperature version (supported at -40 ℃), CA=normal coating version (moisture-proof/corrosion-resistant), some modules do not support suffix extension.

2. Common attachments

Terminals and labels: IC694ACC311 (20 terminal blocks, 6 pieces/pack), IC694ACC003 (module door label);

Diagnosis and testing: IC694ACC300 (DC voltage input simulator), IC695ACC600 (cold junction compensation kit, compatible with IC695ALG600 module);

Upgrade accessories: IC695ACC651 (Series 90-70 to RX3i I/O adapter card), IC695ACC652 (5-slot conversion rack);

Spare parts: IC695ACC002 (plastic casing for CPU/AC power backup), IC695ACC302 (auxiliary intelligent battery module).